Temperature field simulation of building envelopes

Temperature field simulation of building envelopes

LI Hongmei1, JIN Weiliang1, YE Jiachun2, WANG Youwei3 (1.Department of Civil Engineering, Zhejiang University, Hangzhou 310027,China; 2. Architectural Design and Research Institute of Zhejiang Province, Hangzhou 310006, China; 3. China Academy of Building Research, Beijing 100013,China)$$$$

Journal of Building Structures ›› 2004, Vol. 25 ›› Issue (06) : 93-98.

Journal of Building Structures ›› 2004, Vol. 25 ›› Issue (06) : 93-98.

Temperature field simulation of building envelopes

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. Journal of Building Structures, 2004, 25(06): 93-98.

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